原装KMGX6001BA-B514T09多制层封装芯片
制造商 - SAMSUNG
封装 - FBGA-221
存储类型 - EMCP
描述 - 多芯片封装存储器
eStorage 密度 - 32GB
DRAM 密度 - 24Gb
速率 - 1866Mbps
封装 - 221FBGA
Equip mobile devices for the age of AI and 5G. DRAM and NAND come together in a single compact package to deliver flagship-level performance. LPDDR5 uMCP brings high-bandwidth storage and memory, crucial for the increasingly data-heavy demands of smartphones, wearables, and AI technology. Take less space and offer capabilities for the ever-growing 5G world.
全新原包原装可含税（香港可交）
KMGX6001BA-B514
KMGP6001BA-B514
KMFN60012M-B214
KMDX60018M-B425
KLMDG8JENB-B041
KLMCG4JETD-B041
KLMBG2JETD-B041
KLMAG1JETD-B041
KLM8G1GETF-B041
KLM4G1FETE-B041
K9F1G08U0E-SIB0
K4Z80325BC-HC14
K4G80325FC-HC25
K4E8E324ED-EGCG
K4E8E324EB-EGCF
K4E6E304EB-EGCF
K4E6E304ED-EGCG
K4E6E304EC-EGCG
K4E6E304EC-EGCF
询价
