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原装H26M41208HPR NAND Flash的技术参数:
工作温度 : -25 °C ~85 °C
组织 : 8GX8
包装说明 : VFBGA
ECCN代码 : EAR99
风险等级 : 5.79
内存集成电路类型 : FLASH
编程电压 : 3.3 V
标称供电电压 (Vsup) : 3.3 V
表面贴装 : YES
技术 : CMOS
温度等级 : OTHER
端子形式 : BALL
端子节距 : 0.5 mm
端子位置 : BOTTOM
内存宽度 : 8
功能数量 : 1
并行/串行 : PARALLEL
尺寸 11.5x13x0.8
JESD-30 代码 : R-PBGA-B153
供电电压 (Vsup) : 2.7 V ~ : 3.6 V
峰值回流温度(摄氏度) : NOT SPECIFIED
封装形式 : GRID ARRAY, VERY THIN PROFILE, FINE PITCH
原装H26M41208HPR NAND Flash 的关键特性
• eMMC5.1 compatible
(Backward compatible to eMMC4.5&eMMC5.0)
• Bus mode
- Data bus width : 1bit(default), 4bits, 8bits
- Data transfer rate: up to 400MB/s (HS400)
- MMC I/F Clock frequency : 0~200MHz
- MMC I/F Boot frequency : 0~52MHz
• Operating Voltage Range
- Vcc (NAND) : 2.7V - 3.6V
- Vccq (Controller) : 1.7V - 1.95V / 2.7V ~ 3.3V
• Temperature
- Operation (-25℃ ~ +85℃)
- Storage without operation (-40℃ ~ +85℃)
• Others
- This product is compliance with the RoHS directive
• Supported Features
- HS400, HS200
- HPI, BKOPS, BKOP operation control
- Packed CMD, CMD queuing
- Cache, Cache barrier, Cache flushing report
- Partitioning, RPMB, RPMB throughput improve
- Discard, Trim, Erase, Sanitize
- Write protect, Secure write protection
- Lock/Unlock
- PON, Sleep/Awake
- Reliable Write
- Boot feature, Boot partition
- HW/SW Reset
- Field Firmware Update
- Configurable driver strength
- Health(Smart) report
- Production state awareness
- Secure removal type
- Data Strobe pin, Enhanced data strobe
(Bold features are added in eMMC5.1)