KLM8G1WEMB-B031原装EMMC
SAMSUNG e·MMC is an embedded MMC solution designed in a BGA package form. e·MMC operation is identical to a MMC device and therefore is a simple read and write to memory using MMC protocol v5.0 which is a industry standard.
e·MMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VDDF or VCC) whereas 1.8V or 3V dual supply voltage (VDD or VCCQ) is supported for the MMC controller. SAMSUNG e•MMC supports 200MHz DDR–up to 400MBps with bus widths of 8 bit in order to improve sequential bandwidth, especially sequential read performance.
SAMSUNG e·MMC is an embedded MMC solution designed in a BGA package form. e·MMC operation is identical to a MMC device and therefore is a simple read and write to memory using MMC protocol v5.0 which is a industry standard.
e·MMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VDDF or VCC) whereas 1.8V or 3V dual supply voltage (VDD or VCCQ) is supported for the MMC controller. SAMSUNG e•MMC supports 200MHz DDR–up to 400MBps with bus widths of 8 bit in order to improve sequential bandwidth, especially sequential read performance.
KLM8G1WEMB-B031原装EMMC的技术参数：
|
制造商 |
SAMSUNG |
|
封装 |
FBGA-153 |
|
容量 |
8GB（64G*1） |
|
封装尺寸 |
11.5 x 13 x 0.8 mm |
|
温度 |
-25°C TO 85°C |
|
电压规格 |
2.7V to 3.6V |
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KMGX6001BA-B51410000BGA22+SAMSUNG/三星
KMGP6001BA-B51410000BGA22+SAMSUNG/三星
KMFN60012M-B21410000BGA22+SAMSUNG/三星
KMDX60018M-B42510000BGA22+SAMSUNG/三星
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KLMCG4JETD-B04110000BGA22+SAMSUNG/三星
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KLMAG1JETD-B04110000BGA22+SAMSUNG/三星
KLM8G1GETF-B04110000BGA22+SAMSUNG/三星
KLM4G1FETE-B04110000BGA22+SAMSUNG/三星
K9F1G08U0E-SIB010000BGA22+SAMSUNG/三星
K4Z80325BC-HC1410000BGA22+SAMSUNG/三星
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K4E8E324EB-EGCF10000BGA22+SAMSUNG/三星
K4E6E304EB-EGCF10000BGA22+SAMSUNG/三星
K4E6E304ED-EGCG10000BGA22+SAMSUNG/三星
K4E6E304EC-EGCG10000BGA22+SAMSUNG/三星
K4E6E304EC-EGCF10000BGA22+SAMSUNG/三星
K4B4G1646E-BYMA10000BGA22+SAMSUNG/三星
K4B4G1646E-BYK010000BGA22+SAMSUNG/三星
K4B4G1646E-BCNB10000BGA22+SAMSUNG/三星
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