THGBMHG7C1LBAIL 原装 EMMC
e•MMCTM is a family of advanced, highly efficient NAND flash memory with an integrated controller and enhanced memory management. Based on an interface standardized by JEDEC, Toshiba’s e•MMC offers a suitable solution for applications in which higher data volumes need to be stored in a cost-efficient way. It is fully compliant with the Multimedia Card Association (MMCA) highspeed memory interface standard.
THGBMHG7C1LBAIL 原装 EMMC 的技术参数：
|
型号 |
THGBMHG7C1LBAIL |
|
品牌 |
东芝 |
|
存储器容量 |
16 Gb |
|
工作温度 |
-25℃ TO 85℃ |
|
外包装 |
TRAY |
|
描述 |
16GB 15nm eMMC (EEPROM) |
|
封装 |
WFBGA-153 |
|
时钟频率 |
52 MHz |
|
电压 - 供电 |
2.7V ~ 3.6V |
|
时钟频率 |
52 MHz |
|
RoHS 状态 |
符合 ROHS3 规范 |
|
湿气敏感性等级 (MSL) |
3（168 小时） |
• 4GB – 128GB
• 15nm
• MLC technology
• Conforms to the latest JEDEC
Version 5.0 and 5.1
• Integrated memory management
• Error correction code
• Bad block management
• Wear-leveling
• Garbage collection
• Standard and extended temperature
range
• FBGA package
▊100%原装现货▊ 有需求联系我们
MT29F64G08CBABBWPR:B 10000 TSOP 22+ MICRON/美光
KLMBG2JETD-B041 10000 BGA 22+ SAMSUNG/三星
KLMAG1JETD-B041 10000 BGA 22+ SAMSUNG/三星
KLM8G1GETF-B041 10000 BGA 22+ SAMSUNG/三星
KLM4G1FETE-B041 10000 BGA 22+ SAMSUNG/三星
K4E8E324EB-EGCF 10000 BGA 22+ SAMSUNG/三星
K4E6E304EB-EGCF 10000 BGA 22+ SAMSUNG/三星
K4E6E304EC-EGCG 10000 BGA 22+ SAMSUNG/三星
K4B4G1646E-BCNB 10000 BGA 22+ SAMSUNG/三星
K4A8G165WB-BCRC 10000 BGA 22+ SAMSUNG/三星
THGBMNG5D1LBAIL 10000 BGA 22+ KOXIA/铠侠
THGBMJG7C1LBAIL 10000 BGA 22+ KOXIA/铠侠
THGBMJG6C1LBAIL 10000 BGA 22+ KOXIA/铠侠
THGBMHG6C1LBAIL 10000 BGA 22+ KOXIA/铠侠
TC58NVG1S3HTA00 10000 BGA 22+ KOXIA/铠侠
TC58NVG0S3HTA00 10000 BGA 22+ KOXIA/铠侠
TC58NVG0S3ETAI0 10000 BGA 22+ KOXIA/铠侠
TC58BVG1S3HTA00 10000 BGA 22+ KOXIA/铠侠
TC58BVG0S3HTA00 10000 BGA 22+ KOXIA/铠侠
询价
