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供应MT29F64G08CBABAWP 原装 NAND FLASH
供应MT29F64G08CBABAWP 原装 NAND FLASH
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MT29F64G08CBABAWP 原装 NAND FLASH

型号:

MT29F64G08CBABAWP

制造商:

MICRON/镁光

封装:

TSOP

批次:

22+

无铅/环保:

无铅/环保

产品信息

MT29F64G08CBABAWP 原装 NAND FLASH

 

特征:

Open NAND Flash Interface (ONFI) 2.3-compliant1

Multiple-level cell (MLC) technology

Organization

Page size x8: 8936 bytes (8192 + 744 bytes)

Block size: 256 pages (2048K + 186K bytes)

Plane size: 2 planes x 2048 blocks per plane

Device size: 64Gb: 4096 blocks;

128Gb: 8192 blocks;

256Gb: 16,384 blocks;

512Gb: 32,786 blocks

Synchronous I/O performance

Up to synchronous timing mode 52

Clock rate: 10ns (DDR)

Read/write throughput per pin: 200 MT/s

Asynchronous I/O performance

Up to asynchronous timing mode 5

tRC/tWC: 20ns (MIN)

Array performance

Read page: 75μs (MAX)

Program page: 1300μs (TYP)

Erase block: 3ms (TYP)

Operating Voltage Range

VCC: 2.73.6V

VCCQ: 1.71.95V, 2.73.6V

Command set: ONFI NAND Flash Protocol

Advanced Command Set

Program cache

Read cache sequential

Read cache random

One-time programmable (OTP) mode

Multi-plane commands

Multi-LUN operations

Read unique ID

Copyback

First block (block address 00h) is valid when ship

ped from factory. For minimum required ECC, see

Error Management (page 117).

RESET (FFh) required as first command after power-on

Operation status byte provides software method for

detecting

Operation completion

Pass/fail condition

Write-protect status

Data strobe (DQS) signals provide a hardware method for synchronizing data DQ in the synchronous

interface

Copyback operations supported within the plane

from which data is read

Quality and reliability

Data retention: JESD47 compliant; see qualification report

Endurance: 3000 PROGRAM/ERASE cycles

Operating temperature:

Commercial: 0°C to +70°C

Industrial (IT): 40oC to +85oC

Package

48-pin TSOP

100-ball BGA


MT29F64G08CBABAWP  原装NAND FLASH 的技术参数:

制造商

Micron Technology

技术

NAND Flash memory

容量

64 GB

温度规格

0C to +70C

外包装

Tape & Reel (TR)

RoHs Status

Lead free/RoHS Compliant

封装/外壳

TSOP

 

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