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供应K4B4G0446D-BYH9 原装 LPDDR3
供应K4B4G0446D-BYH9 原装 LPDDR3
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K4B4G0446D-BYH9 原装 LPDDR3

型号:

K4B4G0446D-BYH9

制造商:

SAMSUNG/三星

封装:

FBGA

批次:

21+/22+

无铅/环保:

无铅/环保

产品信息

K4B4G0446D-BYH9 原装 LPDDR3

DRAM Chip DDR3L SDRAM 4Gbit 1Gx4 1.35V

4Gb D-die DDR3L SDRAM  78FBGA with Lead-Free & Halogen-Free (RoHS compliant)

 

K4B4G0446D-BYH9 原装 LPDDR3 的描述:

The 4Gb DDR3 SDRAM D-die is organized as a 128Mbit x 4 I/Os x 8banks, 64Mbit x 8 I/Os x 8banks device. This synchronous device achieves high speed double-data-rate transfer rates of up to 1866Mb/sec/pin (DDR3- 1866) for general applications.

 

 The chip is designed to comply with the following key DDR3 SDRAM features such as posted CAS, Programmable CWL, Internal (Self) Calibration, On Die Termination using ODT pin and Asynchronous Reset .

 

 All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the crosspoint of differential clocks (CK rising and CK falling). All I/Os are synchronized with a pair of bidirectional strobes (DQS and DQS) in a source synchronous fashion. The address bus is used to convey row, column, and bank address information in a RAS/CAS multiplexing style.

 

The DDR3 device operates with a single 1.35V(1.28V~1.45V) & 1.5V(1.425V~1.575V) power supply and 1.35V(1.28V~1.45V) & 1.5V(1.425V~1.575V) VDDQ. The 4Gb DDR3 D-die device is available in 78ball FBGAs(x4/x8)

 

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