H5TQ4G63CFR-TEC 原装全新 DDR3
制造商 | SK HYNIX |
RoHS | 是 |
工作电压 | 1.5V |
容量 | 4GB |
架构 | 256MX16 |
封装 / 箱体 | FBGA-96 |
工作温度 | 0°C~+95°C |
? VDD=VDDQ=1.5V +/- 0.075V
? Fully differential clock inputs (CK, CK) operation
? Differential Data Strobe (DQS, DQS)
? On chip DLL align DQ, DQS and DQS transition with CK transition
? DM masks write data-in at the both rising and falling edges of the data strobe
? All addresses and control inputs except data, data strobes and data masks latched on the rising edges of the clock
? Programmable CAS latency 5, 6, 7, 8, 9, 10, 11, 13 and 14 supported
? Programmable additive latency 0, CL-1, and CL-2 supported
? Programmable CAS Write latency (CWL) = 5, 6, 7, 8 9 and 10
? Programmable burst length 4/8 with both nibble sequential and interleave mode
? BL switch on the fly
? 8banks
? Average Refresh Cycle (Tcase of 0 oC~ 95 oC)
- 7.8 μs at 0oC ~ 85 oC
- 3.9 μs at 85oC ~ 95 oC
Commercial Temperature( 0oC ~ 95 oC)
Industrial Temperature( -40oC ~ 95 oC)
? JEDEC standard 78ball FBGA(x8), 96ball FBGA (x16)
? Driver strength selected by EMRS
? Dynamic On Die Termination supported
? Asynchronous RESET pin supported
? ZQ calibration supported
? TDQS (Termination Data Strobe) supported (x8 only)
? Write Levelization supported
? 8 bit pre-fetch
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